Process: 40nm

Standard: 3GPP R13/R14 Cat.1bis

Key Features:

· Integrated BB, RF, and PMIC

· Super power-saving

Package: LFBGA 6.1mm × 6.1mm × 1.14mm

Voltage Range: 3.1V to 4.5V

Process: 40nm

Standard: 3GPP R13/R14 Cat.1bis

Key Features:

· Integrated BB, RF, and PMIC

· Super power-saving

· Optimized for data-only modules

Package: LFBGA 5mm × 5mm × 0.89mm (smallest size in the industry)

Supply Chain: Domestic integration for cost optimization

Sub-models: EC716S/E with configurable Flash size (2M/4M)

Process: 22nm

Standard: 3GPP R13/R14 Cat.1bis

Key Features:

· Integrated BB, RF, and PMIC

· Super power-saving

· Voice capacity

· Edge AI and multimedia support

· Memory enhancement

· Open CPU enhancement

Sub-models

EC718: 

LFBGA 6.1mm × 6.1mm × 0.84mm; scalable CPU, RAM, and Flash (2M/4M/8M)

EC718V: 

Voice over LTE

EC718M:

· Domestic supply chain integration for cost optimization

· CPU performance +30%, memory performance ×8

· Significantly enhanced Open CPU capability

· Display interface up to FWVGA (854×480); improved multimedia processing for wearables

· Sub-models: EC718MP/MU/MH with scalable memory configuration and voice option